LPKF, a leading manufacturer of laser and electronic systems, announces that it has added another laser system to its repertoire. The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs.
Dr. Ingo Bretthauer, CEO and Chairman of LPKF, commented, “The MicroLine 1000 S combines a low entry-level price with the highest cutting quality and superior process capabilities. Additionally, it is extremely flexible and, therefore, suited for high manufacturing variance. We are using a laser source that was optimized just for this application.”
With UV-laser cutting of assembled and/or unassembled PCBs, those with limited space will benefit. The UV laser beam can cut along delicate components or circuit paths without mechanical or thermal interference. The tool-less method makes any contour possible. Changes to the cutting paths are made by programming the software included with the machine or directly in the CAD software.
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LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
